Mainland China recently invested by the IGBT 8 inches chip production line, the Chinese academy of sciences IGBT6500V blocking voltage microelectronICs ultra successful, shows that our IGBT field has made certain progress. The next step to make greater development, from the whole IGBT industry chain will be how to strengthen and enhance the consideration of the device IGBT level, such as raw materials, manufacturing technology, manufacturing equipment, test and reliability technology, and application development, personnel training, etc.



The future groove grille, high pressure and field by type (FS) will represent the trend of the development of IGBT, but in many details (design and process) need to consider how to further improve the performance of the IGBT. To create more cost-effective, reliability of IGBT module and a device, need to conquer the difficulty of the problem throughout the IGBT industry chain, including materials, manufacturing technology, manufacturing equipment and reliability technology promotion, etc.